Part Number Hot Search : 
D1206 AM29LV 0895040 BRF106 BUW12W ULQ2003L 10BQ040 GS1007
Product Description
Full Text Search
 

To Download STI30NM60N Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
 STB30NM60N,STI30NM60N,STF30NM60N STP30NM60N, STW30NM60N
N-channel 600 V, 0.1 , 25 A, MDmeshTM II Power MOSFET TO-220, TO-220FP, TO-247, D2PAK, I2PAK
Features
Type STB30NM60N STI30NM60N STF30NM60N STP30NM60N STW30NM60N VDSS @ TJmax 650 V 650 V 650 V 650 V 650 V RDS(on) max <0.13 <0.13 <0.13 <0.13 <0.13 ID 25A 25A 25A(1) 25A 25A PW 190 W 190 W 40 W 190 W 190 W
3 1 2
1 3 2
3 1
3 12
DPAK
2 1 3
IPAK
TO-247
1. Limited only by maximum temperature allowed
100% avalanche tested Low input capacitance and gate charge Low gate input resistance
TO-220
TO-220FP
Application
Figure 1.
Internal schematic diagram
Switching applications
Description
This series of devices is designed using the second generation of MDmeshTM Technology. This revolutionary Power MOSFET associates a new vertical structure to the Company's strip layout to yield one of the world's lowest onresistance and gate charge. It is therefore suitable for the most demanding high efficiency converters.
Table 1.
Device summary
Marking 30NM60N 30NM60N 30NM60N 30NM60N 30NM60N Package DPAK IPAK TO-220FP TO-220 TO-247 Packaging Tape and reel Tube Tube Tube Tube
Order codes STB30NM60N STI30NM60N STF30NM60N STP30NM60N STW30NM60N
July 2008
Rev 2
1/18
www.st.com 18
Contents
STB30NM60N,STI30NM60N,STF30NM60N,STP30NM60N,STW30NM60N
Contents
1 2 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Electrical characteristics (curves) ............................. 6
3 4 5 6
Test circuits
.............................................. 9
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2/18
STB30NM60N,STI30NM60N,STF30NM60N,STP30NM60N,STW30NM60N
Electrical ratings
1
Electrical ratings
Table 2.
Symbol
Absolute maximum ratings
Value Parameter TO-220 IPA K Unit TO-247 DPAK TO-220FP 600 30 25 25 (1) 15.8(1) 100 (1) 40 15 --55 to 150 150 2500 V V A
VDS VGS ID ID IDM (2) PTOT
Drain-source voltage (VGS=0) Gate-source voltage Drain current (continuous) at TC = 25 C Drain current (continuous) at TC = 100 C Drain current (pulsed) Total dissipation at TC = 25 C
15.8 100 190
A A W V/ns V C C
dv/dt (3) Peak diode recovery voltage slope VISO Tstg Tj Insulation withstand voltage (RMS) from all three leads to external heat sink (t=1 s;TC=25 C) Storage temperature Max. operating juncion temperature
1. Limited only by maximum temperature allowed 2. Pulse width limited by safe operating area 3. ISD 25A, di/dt 400A/s, VDD =80% V(BR)DSS
Table 3.
Symbol Rthj-case Rthj-pcb Rthj-amb Tl
Thermal data
Parameter Thermal resistance junction-case max Thermal resistance junction-pcb max Thermal resistance junction-amb max Maximum lead temperature for soldering purposes -62.5 -TO-220 IPAK TO-247 DPAK TO-220FP 0.66 -50 300 30 -3.1 -62.5 Unit C/W C/W C/W C
Table 4.
Symbol IAR EAS
Avalanche characteristics
Parameter Avalanche current, repetitive or not-repetitive (pulse width limited by Tj max) Single pulse avalanche energy (starting Tj = 25C, ID = IAR, VDD = 50V) Max value 12 900 Unit A mJ
3/18
Electrical characteristics
STB30NM60N,STI30NM60N,STF30NM60N,STP30NM60N,STW30NM60N
2
Electrical characteristics
(Tcase =25C unless otherwise specified) Table 5.
Symbol V(BR)DSS IDSS IGSS VGS(th) RDS(on
On /off states
Parameter Drain-source breakdown voltage Test conditions ID = 1 mA, VGS = 0 Min. 600 1 100 100 2 3 0.1 4 0.13 Typ. Max. Unit V A A nA V
VDS = Max rating Zero gate voltage drain current (VGS = 0) VDS = Max rating, TC=125C Gate-body leakage current (VDS = 0) VGS = 20 V
Gate threshold voltage VDS = VGS, ID = 250 A Static drain-source on resistance VGS = 10 V, ID = 12.5 A
Table 6.
Symbol gfs (1) Ciss Coss Crss Coss eq.
Dynamic
Parameter Forward transconductance Input capacitance Output capacitance Reverse transfer capacitance Equivalent Output capacitance Gate input resistance Total gate charge Gate-source charge Gate-drain charge Test conditions VDS = 15 V, ID = 12.5 A Min. Typ. 25 2700 210 22 66 Max. Unit S pF pF pF pF
VDS = 50 V, f = 1 MHz, VGS = 0
VGS = 0, VDS = 0 to 480 V f=1MHz Gate DC Bias=0 Test signal level=20 mV open drain VDD =480 V, ID = 25 A, VGS = 10 V (see Figure 19)
Rg Qg Qgs Qgd
3 91 14 50
nC nC nC
1. Pulsed: Pulse duration = 300 s, duty cycle 1.5%
4/18
STB30NM60N,STI30NM60N,STF30NM60N,STP30NM60N,STW30NM60N
Electrical characteristics
Table 7.
Symbol td(on) tr td(off) tf
Switching times
Parameter Turn-on delay time Rise time Turn-off-delay time Fall time Test conditions VDD = 300 V, ID = 12.5 A, RG = 4.7 , VGS = 10 V (see Figure 18) Min. Typ. 20 24 125 70 Max Unit ns ns ns ns
Table 8.
Symbol ISD ISDM (1) VSD (2) trr Qrr IRRM trr Qrr IRRM
Source drain diode
Parameter Source-drain current Source-drain current (pulsed) Forward on voltage Reverse recovery time Reverse recovery charge Reverse recovery current Reverse recovery time Reverse recovery charge Reverse recovery current ISD = 25 A, VGS = 0 ISD = 25 A, di/dt = 100 A/s VDD= 100 V (see Figure 23) ISD = 25 A, di/dt = 100 A/s VDD= 100 V Tj = 150C (see Figure 23) 540 10 36 630 12 36 Test conditions Min Typ. Max Unit 25 100 1.3 A A V ns C A ns C A
1. Pulse width limited by safe operating area 2. Pulsed: pulse duration = 300s, duty cycle 1.5%
5/18
Electrical characteristics
STB30NM60N,STI30NM60N,STF30NM60N,STP30NM60N,STW30NM60N
2.1
Figure 2.
Electrical characteristics (curves)
Safe operating area for TO-220 / DPAK / IPAK Figure 3. Thermal impedance for TO-220 / DPAK / IPAK
Figure 4.
Safe operating area for TO-220FP
Figure 5.
Thermal impedance for TO-220FP
Figure 6.
Safe operating area for TO-247
Figure 7.
Thermal impedance for TO-247
6/18
STB30NM60N,STI30NM60N,STF30NM60N,STP30NM60N,STW30NM60N Figure 8.
ID(A) VGS=10V 30 25
5V
5
Electrical characteristics
Output characteristics
AM00051v1
Figure 9.
ID(A)
Transfer characteristics
AM00052v1
4
20
3
15
2
10
1
5
4V
0
0
0
5
10
15
20
25
30 VSD(V)
0
2
4
6
8
VGS(V)
Figure 10. Transconductance
Gfs(S)
AM00048v1
Figure 11. Static drain-source on resistance
AM00046v1
RDS(on) () 0.135
30.5
TJ=-50C
25.5
25C
0.115
150C
20.5
0.095 VGS=10V ID=12.5A
15.5
0.075
10.5
0.055
5.5
0.035
0.5
0 5 10 15 20 25 30 ID(A)
0.015 0 5 10 15 20 25 30 ID(A)
Figure 12. Gate charge vs gate-source voltage Figure 13. Capacitance variations
VGS(V) 12 10 8 6
100 1000
AM00045v1
AM00044v1
C(pF)
VDD=480V ID=25A
10000
Ciss
Coss
4 2 0 0 20 40 60 80 100 Qg(nC)
1 0.1 1 10 100 10
Crss
VGS(V)
7/18
Electrical characteristics
STB30NM60N,STI30NM60N,STF30NM60N,STP30NM60N,STW30NM60N Figure 15. Normalized on resistance vs temperature
RDS(on) (norm)
AM00047v1
Figure 14. Normalized gate threshold voltage vs temperature
VGS(th)
(norm)
AM00043v1
1.1
ID=250A
2.1 1.9 1.7 1.5 1.3 1.1 0.9 0.7 0.5
1.05 1 0.95 0.9 0.85 0.8 0.75 0.7
-50
-25
0
25
50
75
100
125 TJ(C) 150
-50
-25
0
25
50
75
100
125
TJ(C) 150
Figure 16. Source-drain diode forward characteristics
VSD(V) 1 0.8 0.6 0.4 0.2
TJ=-50C
AM00050v1
Figure 17. Normalized BVDSS vs temperature
BVDSS
(norm)
AM00049v1
25C 150C
1.07 1.05 1.03 1.01 0.99 0.97 0.95
0 0 10 20
0.93
ISD(A)
-50
-25
0
25
50
75
100
125
150 TJ(C)
8/18
STB30NM60N,STI30NM60N,STF30NM60N,STP30NM60N,STW30NM60N
Test circuits
3
Test circuits
Figure 19. Gate charge test circuit
Figure 18. Switching times test circuit for resistive load
Figure 20. Test circuit for inductive load Figure 21. Unclamped inductive load test switching and diode recovery times circuit
Figure 22. Unclamped inductive waveform
Figure 23. Switching time waveform
9/18
Package mechanical data STB30NM60N,STI30NM60N,STF30NM60N,STP30NM60N,STW30NM60N
4
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com
10/18
STB30NM60N,STI30NM60N,STF30NM60N,STP30NM60N,STW30NM60N Package mechanical data
TO-220 mechanical data
mm Dim Min A b b1 c D D1 E e e1 F H1 J1 L L1 L20 L30 P Q 4.40 0.61 1.14 0.48 15.25 1.27 10 2.40 4.95 1.23 6.20 2.40 13 3.50 16.40 28.90 3.75 2.65 3.85 2.95 0.147 0.104 10.40 2.70 5.15 1.32 6.60 2.72 14 3.93 0.393 0.094 0.194 0.048 0.244 0.094 0.511 0.137 Typ Max 4.60 0.88 1.70 0.70 15.75 Min 0.173 0.024 0.044 0.019 0.6
inch Typ Max 0.181 0.034 0.066 0.027 0.62 0.050 0.409 0.106 0.202 0.051 0.256 0.107 0.551 0.154 0.645 1.137 0.151 0.116
11/18
Package mechanical data STB30NM60N,STI30NM60N,STF30NM60N,STP30NM60N,STW30NM60N
TO-220FP mechanical data
Dim. A B D E F F1 F2 G G1 H L2 L3 L4 L5 L6 L7 Dia 28.6 9.80 2.9 15.90 9 3 mm. Min. 4.40 2.5 2.5 0.45 0.75 1.15 1.15 4.95 2.40 10 16 30.6 10.60 3.6 16.40 9.30 3.2 1.126 0.385 0.114 0.626 0.354 0.118 Typ Max. 4.60 2.7 2.75 0.70 1.00 1.50 1.50 5.20 2.70 10.40 Min. 0.173 0.098 0.098 0.017 0.030 0.045 0.045 0.195 0.094 0.393 0.630 1.204 0.417 0.141 0.645 0.366 0.126 inch Typ. Max. 0.181 0.106 0.108 0.027 0.039 0.067 0.067 0.204 0.106 0.409
A
B
L3 L6 L7
Dia
F1
D
F
G1 H
F2
L2 L5
E
123
L4
7012510-I
12/18
G
STB30NM60N,STI30NM60N,STF30NM60N,STP30NM60N,STW30NM60N Package mechanical data
TO-247 Mechanical data
mm. Min. 4.85 2.20 1.0 2.0 3.0 0.40 19.85 15.45 5.45 14.20 3.70 18.50 3.55 4.50 5.50 3.65 5.50 14.80 4.30 Typ Max. 5.15 2.60 1.40 2.40 3.40 0.80 20.15 15.75
Dim. A A1 b b1 b2 c D E e L L1 L2 oP oR S
13/18
Package mechanical data STB30NM60N,STI30NM60N,STF30NM60N,STP30NM60N,STW30NM60N
IPAK (TO-262) mechanical data
mm Dim Min A A1 b b1 c c2 D e e1 E L L1 L2 4.40 2.40 0.61 1.14 0.49 1.23 8.95 2.40 4.95 10 13 3.50 1.27 Typ Max 4.60 2.72 0.88 1.70 0.70 1.32 9.35 2.70 5.15 10.40 14 3.93 1.40 Min 0.173 0.094 0.024 0.044 0.019 0.048 0.352 0.094 0.194 0.393 0.511 0.137 0.050
inch Typ Max 0.181 0.107 0.034 0.066 0.027 0.052 0.368 0.106 0.202 0.410 0.551 0.154 0.055
14/18
STB30NM60N,STI30NM60N,STF30NM60N,STP30NM60N,STW30NM60N Package mechanical data
DPAK (TO-263) mechanical data
mm Dim Min A A1 b b2 c c2 D D1 E E1 e e1 H J1 L L1 L2 R V2 4.40 0.03 0.70 1.14 0.45 1.23 8.95 7.50 10 8.50 2.54 4.88 15 2.49 2.29 1.27 1.30 0.4 0 8 0 5.28 15.85 2.69 2.79 1.40 1.75 0.192 0.590 0.099 0.090 0.05 0.051 Typ Max 4.60 0.23 0.93 1.70 0.60 1.36 9.35 10.40 Min 0.173 0.001 0.027 0.045 0.017 0.048 0.352 0.295 0.394 0.334
inch Typ Max 0.181 0.009 0.037 0.067 0.024 0.053 0.368 0.409 0.1 0.208 0.624 0.106 0.110 0.055 0.069 0.016 8
0079457_M
15/18
Packaging mechanical data
5
Packaging mechanical data
D2PAK FOOTPRINT
TAPE AND REEL SHIPMENT
REEL MECHANICAL DATA
DIM. A B C D G N T 1.5 12.8 20.2 24.4 100 30.4 26.4 13.2 mm MIN. MAX. 330 0.059 0.504 0.520 0795 0.960 1.039 3.937 1.197 BULK QTY 1000 inch MIN. MAX. 12.992
TAPE MECHANICAL DATA
DIM. A0 B0 D D1 E F K0 P0 P1 P2 R T W mm MIN. 10.5 15.7 1.5 1.59 1.65 11.4 4.8 3.9 11.9 1.9 50 0.25 23.7 24.3 MAX. 10.7 15.9 1.6 1.61 1.85 11.6 5.0 4.1 12.1 2.1 inch MIN. MAX. 0.413 0.421 0.618 0.626 0.059 0.063 0.062 0.063 0.065 0.073 0.449 0.456 0.189 0.197 0.153 0.161 0.468 0.476 0.075 0.082 1.574 0.35 0.0098 0.0137 0.933 0.956
BASE QTY 1000
* on sales type
16/18
STB30NM60N,STI30NM60N,STF30NM60N,STP30NM60N,STW30NM60N
Revision history
6
Revision history
Table 9.
Date 23-Oct-2007 09-Jul-2008
Document revision history
Revision 1 2 First release. Document status promoted: from preliminary data to datasheet. Changes
17/18
STB30NM60N,STI30NM60N,STF30NM60N,STP30NM60N,STW30NM60N
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
(c) 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com
18/18


▲Up To Search▲   

 
Price & Availability of STI30NM60N

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X